Low CTE Adhesives

One and two component advanced epoxy systems have been developed for joining dissimilar substrates exposed to thermal/mechanically induced stresses. These dimensionally stable, low shrinkage compounds which are formulated with select fillers offer extra low coefficients of thermal expansion. Products provide the integrity of bonded joints even from high/low temperature exposure. Grades consist of electrically insulative and thermally conductive/electrically isolating systems. They are available for use in a variety of viscosities. NASA low outgassing approved systems meet ASTM E595 requirements for critical aerospace, optical, electronic and specialty OEM needs. Select products have been employed as thermal interface materials to optimize heat transfer and improve device reliability.


产品GydF4y2Ba CTE PPM /°C @ 23°CGydF4y2Ba T.GydF4y2BaGGydF4y2Ba 服务温度范围GydF4y2Ba
EP42HT-2LTE.GydF4y2Ba 9-12GydF4y2Ba 60-70°C.GydF4y2Ba 4K to +300°F (4K to +149°C)
EP30LTE-2GydF4y2Ba 10-13GydF4y2Ba 85-95°C.GydF4y2Ba -100°F至+ 250°F(-73°C至+ 121°C)GydF4y2Ba
ep42ht-3ao.GydF4y2Ba 10-20GydF4y2Ba 140-145°C -100°F to +400°F (-73°C to +204°C)
EP13LTE 15-20GydF4y2Ba 160°C -60°F至+ 500°F(-51°C至+ 260°C)GydF4y2Ba

Common Materials: Typical CTE Range for Comparison
材料GydF4y2Ba CTE PPM /°C @ 23°CGydF4y2Ba
陶瓷GydF4y2Ba 0 - 10GydF4y2Ba
元ls 10 - 30GydF4y2Ba
塑料GydF4y2Ba 40 - 120GydF4y2Ba
橡胶GydF4y2Ba 100 - 300或更高GydF4y2Ba

Most Popular Low Coefficient of Thermal Expansion Epoxies