One and two component advanced epoxy systems have been developed for joining dissimilar substrates exposed to thermal/mechanically induced stresses. These dimensionally stable, low shrinkage compounds which are formulated with select fillers offer extra low coefficients of thermal expansion. Products provide the integrity of bonded joints even from high/low temperature exposure. Grades consist of electrically insulative and thermally conductive/electrically isolating systems. They are available for use in a variety of viscosities. NASA low outgassing approved systems meet ASTM E595 requirements for critical aerospace, optical, electronic and specialty OEM needs. Select products have been employed as thermal interface materials to optimize heat transfer and improve device reliability.
|产品GydF4y2Ba||CTE PPM /°C @ 23°CGydF4y2Ba||T.GydF4y2BaGGydF4y2Ba||服务温度范围GydF4y2Ba|
|EP42HT-2LTE.GydF4y2Ba||9-12GydF4y2Ba||60-70°C.GydF4y2Ba||4K to +300°F (4K to +149°C)|
|EP30LTE-2GydF4y2Ba||10-13GydF4y2Ba||85-95°C.GydF4y2Ba||-100°F至+ 250°F（-73°C至+ 121°C）GydF4y2Ba|
|ep42ht-3ao.GydF4y2Ba||10-20GydF4y2Ba||140-145°C||-100°F to +400°F (-73°C to +204°C)|
|EP13LTE||15-20GydF4y2Ba||160°C||-60°F至+ 500°F（-51°C至+ 260°C）GydF4y2Ba|
|Common Materials: Typical CTE Range for Comparison|
|材料GydF4y2Ba||CTE PPM /°C @ 23°CGydF4y2Ba|
|陶瓷GydF4y2Ba||0 - 10GydF4y2Ba|
|元ls||10 - 30GydF4y2Ba|
|塑料GydF4y2Ba||40 - 120GydF4y2Ba|
|橡胶GydF4y2Ba||100 - 300或更高GydF4y2Ba|
Most Popular Low Coefficient of Thermal Expansion Epoxies
T.wo part, room temperature curable epoxy system with high thermal conductivity. Serviceable from cryogenic temperatures up to +400°F. Electrically isolating. Meets NASA low outgassing specifications. Halogen free. Paste consistency. Formulated to cure at ambient temperatures. Withstands 1,000 hours 85°C/85% RH.
T.wo component epoxy system. Extra low thermal expansion coefficient and unmatched dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH.
非滴灌单组分粘合剂。治愈时不会流动。可维护最多+ 500°F。电绝缘。承受1000小时85°C / 85％RH。优异的粘合强度特性。betway必威登陆GydF4y2Ba
超低的热膨胀系数。两个组分，室温固化环氧树脂。可靠的电绝缘体。无与伦比的尺寸稳定性。固化后的低线性和体积收缩。可从-60°F至+ 300°F可维修。承受1000小时85°C / 85％RH。GydF4y2Ba