Die/Laser Cut Preforms

Master Bond's line of epoxy films can be laser or die cut to different configurations for specific application requirements. Preforms are easy to use, require no mixing and reduce waste. They are available in thicknesses of 2 to 8 mils and up to 16 inches square. They offer excellent bond strength to both similar and dissimilar substrates plus high chemical and moisture resistance.

模具/激光切割预成型件的优点

  • Easy processing and minimal squeeze-out during bonding
  • No need for refrigeration
  • Quick curing at moderately elevated temperatures
  • Custom formulated for applications requiring special performance properties

主键预成型件可用于导电,导热和电绝缘版本。可以根据耐温性,耐化学性,柔韧性等定制配方以满足特定要求。

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