填充密封剂for Advance Applications

旨在提高可靠性,主债券的环氧树脂填充组合物的系列提供优异的底部填充物,以便钝化以及与各种基材的突出粘附。它们改善机械支撑,较低的焊点应变,并提供卓越的水分保护。

Applications for Epoxy Underfill Encapsulants

  • 倒装芯片设备
  • Ball grid arrays
  • Chip scale packaging

Advantages of Master Bond Underfill Systems

Both flowable and non-flow systems are available for use. Additionally, to improve efficiency of production snap cure and reworkable systems have been introduced. The key properties of theses systems include:

  • High purity
  • Low stress
  • High adhesion
  • Low coefficient of thermal expansion (CTE)
  • Low outgassing
  • High glass transition temperature (Tg)
  • High Young’s modulus
  • 耐湿性
  • Short cure cycle
  • Structural stability
  • 热量cycling resistance
  • Shock and vibration resistance

Our Most Popular Flip Chip Underfill Systems

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