Polymer Compounds for Printed Circuit Board Assembly


Benefits of Master Bond Electronic Grade Compounds

Master Bond is actively engaged in developing new products for advanced electronic systems. Our compounds offer the following advantages:

  • Widest range of formulations
  • 一致的可再现高性能系统
  • 最新技术
  • 易于应用 - 简单的包装(包括预混合和冷冻注射器)
  • 可直接从制造商提供
  • Custom formulations available

One and Two Component Systems to Meet the Needs of the Electronic Assembly Industry

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