Polymer Compounds for Printed Circuit Board Assembly

从共形涂层到表面安装粘合剂或从导电膜到热管理产品,主键在电子组装应用中引领通道。必威app我们的环氧树脂,硅氧烷,聚氨酯,多硫化物,氰基丙烯酸酯和紫外线固化具有创新的行业要求的创新解决方案。

Benefits of Master Bond Electronic Grade Compounds

Master Bond is actively engaged in developing new products for advanced electronic systems. Our compounds offer the following advantages:

  • Widest range of formulations
  • 一致的可再现高性能系统
  • 最新技术
  • 易于应用 - 简单的包装(包括预混合和冷冻注射器)
  • 可直接从制造商提供
  • Custom formulations available

One and Two Component Systems to Meet the Needs of the Electronic Assembly Industry

Share this