用于半导体组件的粘合剂,密封剂和涂层

High performance complex automated semiconductor equipment meet exacting standards and enable electronic device manufacturers to assemble smaller, smarter, faster, more powerful, affordable products that require lower power consumption. Master Bond adhesives, sealants, coatings, potting/encapsulation compounds consisting of epoxies, silicones have been instrumental in contributing solutions to enhance innovation, maximize productivity while decreasing defects. Master Bond is leading the way in semiconductor packaging with a complete line of underfill, die attach, glob top and encapsulation compounds. These systems are designed for easy processing and dependability.

与供应商和客户合作,主债券的技术专家团队在用于蚀刻,清洁,沉积,光刻,扩散到组装,包装,测试系统的扩散。升级制造技术在这一最具竞争力的行业中非常重要。我们的工程人员遇到了许多困难的技术挑战,并在混合独特的配方中取得了成功,以满足困难的规范要求。

Employing many Master Bond polymeric compositions has provided semiconductor equipment companies design flexibility, reduction in lead times, increased output, lower costs and new opportunities to create technically advanced products at healthy operating margins. Major progress has facilitated smaller geometry chip designs, larger diameter silicon wafers and a transition from aluminum to copper interconnecting. Growing markets for mobile technology, internet of things, rising storage needs will expand the scope of possibility in the digital economy and the anticipated future demand for appropriate semiconductor equipment to keep pace with the ever evolving rapid pace of change. The proliferation in the use of electronic devices will only heighten the significance in the capability of these most vital lines of semiconductor equipment products.

了解有关芯片堆叠应用的粘合剂的更多信息

最流行的半导体行业粘合剂

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