Master Bond's Aerospace Products
技术先进的粘贴、液态薄膜抗利尿激素ive/sealant systems have met challenging design standards that facilitate improved performance, durability, weight savings, fuel efficiency for commercial/business aircraft, rotocraft, satellite and UAV’s. Through extensive research and development Master Bond has formulated products that optimize processing efficiency, meet FST requirements for flame, smoke and toxic emission. High strength systems feature protection against extreme temperatures, corrosion, abrasion, noise, vibration, creep, fatigue, humidity/chemicals.
Certifications of Compliance for Aerospace Applications
A selection of Master Bond grades are formulated to meet industry certifications of compliance such as美国宇航局低调那Federal Aviation Regulations 25.853(a) for flame retardancy那and低烟和毒性的波音标准。
Additionally, select formulations meet用于热稳定性的U.S.MIL-STD 883J（第3.5.3节）andU.S. MIL-STD 810G (Method 508.7) for fungus resistance。
Master Bond adhesives are used in numerous segments of the aerospace industry including:
方便，用户友好的包装选项，如一个/两个组件墨盒，管，Flexipaks®ensure reliability, reduce cycle times for MRO usage. This includes metal/honeycomb/composite bonding, filling/fairing surface irregularities and sealing fluid leakage.
Master Bond is a member of the Society for the Advancement of Material & Process Engineering.
Some of Our Most Popular Aerospace Adhesives, Sealants and Coatings
Two component, room temperature curing structural epoxy system. Excellent bonding properties. Superior thermal cycling capabilities. Convenient one to one mix ratio by volume. Moderate viscosity. Toughened system. Outstanding resistance to water, fuels, various solvents acids and bases. Shore D hardness 75-80.
Highly flexible, low viscosity, optically clear adhesive. Resistant to severe thermal cycling and thermal shock. Bonds well to dissimilar substrates. Low exotherm system. Long working life. Superior electrical insulation properties. Service temperature range from 4K to +250°F. One to one mix ratio by weight or volume.
One part structural epoxy with high bond strength and excellent adhesion to similar and dissimilar substrates, especially composite materials. Requires oven curing at 250-300°F. NASA low outgassing approved. Serviceable from 4k to +400°F. Tough and durable. 85°C/85% RH resistance.
Two part, room temperature curable epoxy system with high thermal conductivity. Serviceable from cryogenic temperatures up to +400°F. Electrically isolating. Meets NASA low outgassing specifications. Halogen free. Paste consistency. Formulated to cure at ambient temperatures. Withstands 1,000 hours 85°C/85% RH.
银系统具有优良的电子欺诈ductivity and high physical strength properties. One part, heat cured (250-300°F) epoxy. Wide range of serviceability from cryogenic temperatures up to +400°F. Meets NASA low outgassing specifications. Can be applied without sagging or dripping, even on vertical surfaces. Volume resistivit <0.006 ohm-cm. Thermally conductive. Shore D hardnes >75.
Easily processable, two part epoxy with excellent chemical resistance, particularly to solvents. Available in black. 100% reactive. Low viscosity. Ambient temperature cure. Service temperature range from -60°F to +300°F.
Two part, fast setting (3-5 minutes in 10-20 gram masses) room temperature curing epoxy. Serviceable from -60°F to +400°F. Tg of 125-130C. NASA low outgassing approved. Used by Boeing in various MRO applications. High tensile modulus. Excellent dimensional stability. Withstands 1,000 hours 85°C/85%RH. Can be applied with gun dispenser.